ECN_logoJuly 29, 2015 — In this Engineering Live broadcast, panelists from around the globe will come together to discuss: New packaging techniques for low power devices.
Potential power solutions.
Innovative interfaces, and the possibilities offered by OLED technology.
How these new technologies will communicate and interact with the greater IoT.

Panelists include:
Dr. Will Whittow, Loughborough University, UK, @willwhittow
Dr. Steven LeBoeuf, Ph.D.President, Valencell, Inc., @Valencell_Inc
Nick Langston, Jr, TE Connectivity @nicklangstonjr Read More